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Tingyen Chiang
HIndex: 6
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Steady state
Copper
Chip
Permittivity
Electromigration
Low-power electronics
Radio-frequency engineering
Thermal analysis
Radio frequency
Heat sink
Temperature
Thermal resistance
Three-dimensional space
Thermal management of electronic devices and systems
Finite element method
HVAC
Index term
Thermal conductivity
Dielectric
System on a chip
Very-large-scale integration
Capacitance
Joule heating
Current density
Aspect ratio
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Steady state
Copper
Chip
Permittivity
Electromigration
Low-power electronics
Radio-frequency engineering
Thermal analysis
Radio frequency
Heat sink
Temperature
Thermal resistance
Three-dimensional space
Thermal management of electronic devices and systems
Finite element method
HVAC
Index term
Thermal conductivity
Dielectric
System on a chip
Very-large-scale integration
Capacitance
Joule heating
Current density
Aspect ratio
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Affiliation
Papers
Tingyen Chiang
Stanford University
9
Tingyen Chiang
National Tsing Hua University
2
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