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Pal Nemeth
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Thin film
Ball grid array
Humidity
Stress testing
Test method
Electronic packaging
Calorimetry
Knowledge engineering
Computer-integrated manufacturing
Packaging engineering
Educational technology
Electrical engineering
Temperature
Amorphous metal
Index term
Integrated circuit packaging
Reliability
Chip-scale package
Prototype
Packaging and labeling
Automotive engineering
Failure rate
Acceleration
Microelectronics
Curie temperature
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Thin film
Ball grid array
Humidity
Stress testing
Test method
Electronic packaging
Calorimetry
Knowledge engineering
Computer-integrated manufacturing
Packaging engineering
Educational technology
Electrical engineering
Temperature
Amorphous metal
Index term
Integrated circuit packaging
Reliability
Chip-scale package
Prototype
Packaging and labeling
Automotive engineering
Failure rate
Acceleration
Microelectronics
Curie temperature
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Pal Nemeth
Budapest University Of Technology And Economics
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