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Chunqing Wang
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Scanning electron microscope
Gold
Metallizing
Intermetallic
Assembly
Thermal conductivity
HVAC
Surface tension
Temperature
Ageing
Chip
Room temperature
Soldering
Tin
Electronic packaging
Finite element method
Nickel
Microstructure
Shape
Copper
Integrated circuit packaging
Packaging and labeling
Reliability
Lead
Three-dimensional space
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Scanning electron microscope
Gold
Metallizing
Intermetallic
Assembly
Thermal conductivity
HVAC
Surface tension
Temperature
Ageing
Chip
Room temperature
Soldering
Tin
Electronic packaging
Finite element method
Nickel
Microstructure
Shape
Copper
Integrated circuit packaging
Packaging and labeling
Reliability
Lead
Three-dimensional space
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Chunqing Wang
Beihang University
205
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